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Dual-track Inline 3D SPI D450/D630

详细介绍

Dual-track Inline 3D SPI D450/D630
Products Description and Specifications
1.Programmable phase modulation profilermetry(PSLM PMP):Sinic-Tek Patent,Its original programmable structure grating can use the software to set the cycle of the grating; Without mechanical drive and transmission part, greatly improving the accuracy of equipment and the scope of application, avoid the mechanical wear and maintenance costs. To achieve high precision 3D solder paste inspection in SMT production line.
2. Sinic-Tek patented synchronous structure of light technology to solve the shadow problem in solder paste inspection. Combined with RG two-dimensional light source to deal with high-contrast substrate, such as black substrate, ceramic substrate. Using red, blue, green three-color light to provide color 2D images;
3.High-resolution image processing system: ultra-high frame 5 million pixel industrial CCD camera, with telecentric lens to support the 01005 component inspection. We also provide 10um, 13.5um, 16.5um and other different detection accuracy, to meet customers different products and speed requirement;
4.Fast Gerber import and programming software, it can achieve 5 minutes programming; Manual Teach function for user programming and inspection without Gerber data;
5.Z-axis real-time compensation to solve flexible PCB and PCB warpage problem.
6.Powerful statistical process control (SPC): real-time SPC information display make users to monitor real-time production problems, reduce the defects caused by solder paste printing and provide the operator with a strong quality control support;
7.Equipment repeatibility accuracy << 10% (6 Sigma).

Equipment Hardware and Software Configuration
Model D450/D630
Measurement Principle 3D white light PSLM PMP(Programmable Spatial Light Modulation,commonly known 
as moire fringe technology)
Measurements Volume,acreage,height, XY offset, shape  
Detected Defects        Missing print,insufficient tin, excessive tin, bridging, offset,shape defect, surface 
contamination
Camera Pixel 5M,10M/12M as option
Lens Types Telecentric lens
Lens Resolution 16.5um,(8/10/12/13.5/18um as option)
FOV Size 5M 16.5um 42*33.5mm,  10M 12um  48*31.5um
Accuracy XY accuracy:10um;height:0.37um
Repeatability Height:<1um (4 Sigma);volume/acreage:<1%(4 Sigma)
Gage R&R <10%
FOV  Speed 0.3s/FOV
Quantity of Inspection Head Twin-Heads(Single Head 、Tri-Heads as option)
Red Green Blue/RGB Three Colas 
Option Light Source
Standard  configuration
Mark-point Detection T 0.5sec/piece
Real-time Z-axis Compensation for PCB Warpage Standard  configuration
Maximun Meauring Height ±550um ( ±1200um as option) 
Lens Types  
Maximun Measuring Height 
of PCB Warp 
±5mm
Minimum Pad Spacing 100um (pad height of 150um as the reference)
Smallest  Measuring Size Rectangle:150um;round:200um
Maximum PCB Size (dual-track model):50*50~L450/630 x W300 mm
(single track model):50*50~L450/630 xW590 mm
PCB Thickness 0.4-7mm
Top and Bottom Clearance Top:40mm  Bottom:40mm
Board Edge Clearance 3mm ,multifunctional clip edge  as option
Flexible or Fixed Orbit Setting Track 1 fixed, track 2,3,4 flexible
PCB Transfer Direction Left to right or right to left
Orbit Width Adjustment Manual and automatic
SPC Statistics Histogram;Xbar-R Chart;Xbar-S Chart;CP&CPK;%Gage Repartability Data;
SPI Daily/Weekly/Monthly Reports
Gerber & CAD Data Import Support Gerber format(274x,274d);manual Teach model;CAD X/Y,Part No.,
Package Type import
Computer Types HP Precision Workstation
CPU Intel 6-core,Intel 8-core as option
RAM 32G ,48/64G as option
GPU 2G discrete graphics(6G/8G DP as option)
Hard Disk 1T 
DVD+RW Standard  configuration
Operating System  Windows 7 Professional ( 64 bit)
Equipment Dimension and Weight W1000*D1330*H1530mm;1050KG
W1200*D1330*H1530mm;1200KG
Power 220V、10A
Air Pressure 4~6Bar
Power (Start / normal) start:2.5kw /    normal operation:2kw
Loading Requirements of the Floor 750kg/m²
Options Multifunctional clip edge, camera barcode, 1D / 2D Barcode scanner, offline programming software,  UPS continuous power supply,ultrasonic sensor,support pin
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