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High Precision 3D SPI Ultra Series


High Precision 3D SPI Ultra Series

1.Programmable phase modulation profilermetry(PSLM PMP):Sinic-Tek Patent,Its original programmable structure grating can use the software to set the cycle of the grating; Without mechanical drive and transmission part, greatly improving the accuracy of equipment and the scope of application, avoid the mechanical wear and maintenance costs. To achieve high precision 3D solder paste inspection in SMT production line.
2. Sinic-Tek patented synchronous structure of light technology to solve the shadow problem in solder paste inspection. Combined with RG two-dimensional light source to deal with high-contrast substrate, such as black substrate, ceramic substrate. Using red, blue, green three-color light to provide color 2D images;
3.High-resolution image processing system: ultra-high frame 10 million pixel industrial CCD camera, with telecentric lens to support the 01005 component inspection. We also provide 10um, 13.5um, 16.5um and other different detection accuracy, to meet customers different products and speed requirement;
4.Fast Gerber import and programming software, it can achieve 5 minutes programming; Manual Teach function for user programming and inspection without Gerber data;
5.Z-axis real-time compensation to solve flexible PCB and PCB warpage problem.
6.Powerful statistical process control (SPC): real-time SPC information display make users to monitor real-time production problems, reduce the defects caused by solder paste printing and provide the operator with a strong quality control support;
7. Equipment repeatibility accuracy << 10% (6 Sigma).

Model Ultra Series
Measurement Principle 3D white light PSLM PMP(Programmable Spatial Light Modulation,commonly 
known as moire fringe technology)
Measurements Volume,acreage,height, XY offset, shape  
Detected Defects Missing print,insufficient tin, excessive tin, bridging, offset,shape defect, surface 
Camera Pixel 10M,12M as option
Lens Types Telecentric lens
Lens Resolution 12um,6/8/10/15um as option
FOV Size 48*31.5mm
XY Positioning Accuracy 0.5um(Grating ruler)
Repeatability Height:<1um (6 Sigma);volume/acreage:<1%(6 Sigma)
Gage R&R <10%
FOV  Speed 0.3s/FOV
Quantity of Inspection Head Three Heads
Red Green Blue/RGB Three Colas 
Option Light Source
Standard  configuration
Mark-point Detection Time 0.5sec/piece
Real-time Z-axis Compensation for PCB Warpage Standard  configuration
Maximun Meauring Height ±550um (±1200um as option) 
Maximun Measuring Height 
of PCB Warp 
Minimum Pad Spacing 100um (pad height of 100um as the reference)
Smallest  Measuring Size Rectangle:100um;Round:150um
Maximum PCB Size L460*W460mm/L630*W550mm
PCB Thickness 0.4-7mm
Top and Bottom Clearance Top:40mm  Bottom:40mm
Board Edge Clearance 3mm ,multifunctional clip edge  as option
Flexible or Fixed Orbit Setting Front orbit  (back orbit as option)
PCB Transfer Direction Left to right or right to left
Orbit Width Adjustment Manual and automatic
SPC Statistics Histogram;Xbar-R Chart;Xbar-S Chart;CP&CPK;%Gage Repartability Data;
SPI Daily/Weekly/Monthly Reports
Gerber & CAD Data Import Support Gerber format(274x,274d);Manual Teach model;
CAD X/Y,Part No.,Package Type import
Computer Types HP Precision Workstation
CPU Intel 8-core
RAM 64G ,128G as option
GPU 8G discrete graphics
Hard Disk 2T
DVD+RW Standard  configuration
Operating System  Windows 7 Professional (64 bit)
Equipment Dimension and Weight W1200*D1000*H1525mm;865KG
Power 220V、10A
Air Pressure 4~6Bar
Power (Start / normal) Start:2.5kw /   normal operation:2kw
Loading Requirements of the Floor 600kg/m²
Options Multifunctional clip edge, 1D / 2D Barcode scanner, offline programming software, rework station, UPS continuous power supply,ultrasonic sensor

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  • HOTLINE:400-0755-021